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Wafer Inspection Standards

Wafer deposition calibration standard*Diese Seite ist leider nur in Englisch verfügbar.*

Characterize and optimize the sensitivity and overall performance of your wafer inspection system with Wafer Deposition Calibration Standards from MSP.  These high-quality calibration standards are made to your specifications with a quick turn-around, enabling short learning cycles during tool development and providing timely quality assurance for installed systems.

MSP Wafer Deposition Calibration Standards consist of particles deposited on a wafer (100 mm to 450 mm) with the industry's best particle size and count control. Using the advanced particle generation and DMA technology of MSP's Particle Deposition Systems, the modal diameter of deposited nanoparticles is controlled with nanometer-level accuracy and sub-nanometer resolution.Triple wrapped wafer packaging

Every substrate is handled with extreme care and packaged with MSP's signature triple-wrap packaging, preventing contamination during transport.

Deposit Patterns

Particles can be deposited in Spot, Full (Blanket), Arc, and Ring patterns.

Particle Materials/Types

Particle size standards available for deposition include spheres of PSL (polystyrene latex) and SiO2 (including MSP NanoSilica™ Size Standards). MSP Process Particles™ Suspensions are offered in 13 materials for deposition.

Wafer Inspection Standard Base Items

The Wafer Deposition Calibration Standard includes a base item, which consists of one deposit on a wafer. MSP provides 150 mm, 200 mm, and 300 mm bare silicon (Si) wafers. Customers can also provide wafers of their choice (bare, film, patterned) for deposition, including wafers constructed from materials other than silicon (e.g., glass). Wafers as small as 100 mm and as large as 450 mm can be processed.

The base item includes a Deposition Summary, Certificate of Conformance, Certificate of Calibration for each particle size standard, and triple-wrap packaging.

300 mm Wafer Base Items

Model Wafer Calibration
Standard Description
Deposit
Pattern
Particle
Material
Particle Size*
5016request a quote 300 mm Spot PSL Spot PSL 20 nm to 1.6 µm
5017request a quote 300 mm Spot SiO2, NanoSilica Spot SiO2 20 nm to 1.6 µm
5032request a quote 300 mm Spot Si3N4 Spot Si3N4 20 nm to 1.6 µm
5034request a quote 300 mm Spot Al2O3 Spot Al2O3 20 nm to 1.6 µm
5069request a quote 300 mm Spot Process Particles Spot Process Particles 20 nm to 1.6 µm
5085request a quote 300 mm Spot Small Particles Spot SiO2 10 nm to <20 nm
5084request a quote 300 mm Spot Large Particles Spot PSL, SiO2 >1.6 µm to 20 µm
5018request a quote 300 mm Full PSL Full PSL 20 nm to 1.6µm
5019request a quote 300 mm Full SiO2, NanoSilica Full SiO2 20 nm to 1.6 µm
5090request a quote 300 mm Full Process Particles Full Process Particles 20 nm to 1.6 µm
5041request a quote 300 mm Full Small Particles Full SiO2 10 nm to <20 nm
5038request a quote 300 mm Full Large Particles Full PSL, SiO2 >1.6 µm to 20 µm

* Range of particle size available for the indicated item. Particle size standards are only available in discrete sizes.

200 mm Wafer Base Items

Model Wafer Calibration
Standard Description
Deposit
Pattern
Particle
Material
Particle Size*
5010request a quote 200 mm Spot PSL Spot PSL 20 nm to 1.6 µm
5011request a quote 200 mm Spot SiO2, NanoSilica Spot SiO2 20 nm to 1.6 µm
5031request a quote 200 mm Spot Si3N4 Spot Si3N4 20 nm to 1.6 µm
5033request a quote 200 mm Spot Al2O3 Spot Al2O3 20 nm to 1.6 µm
5068request a quote 200 mm Spot Process Particles Spot Process Particles 20 nm to 1.6 µm
5087request a quote 200 mm Spot Process Particles Spot SiO2 10 nm to <20 nm
5086request a quote 200 mm Spot Large Particles Spot PSL, SiO2 >1.6 µm to 20 µm
5012request a quote 200 mm Full PSL Full PSL 20 nm to 1.6 µm
5013request a quote 200 mm Full SiO2, NanoSilica Full SiO2 20 nm to 1.6 µm
5091request a quote 200 mm Full Process Particles Full Process Particles 20 nm to 1.6 µm
5092request a quote 200 mm Full Large Particles Full PSL, SiO2 >1.6 µm to 20 µm

* Range of particle size available for the indicated item. Particle size standards are only available in discrete sizes.

150 mm Wafer Base Items

Model Additional Wafer
Deposition Description
Deposit
Pattern
Particle
Material
Particle Size*
5059request a quote 150 mm Spot PSL Spot PSL 20 nm to 1.6 µm
5060request a quote 150 mm Spot SiO2, NanoSilica Spot SiO2 20 nm to 1.6 µm
5063request a quote 150 mm Spot Process Particles Spot Process Particles 20 nm to 1.6 µm
5089request a quote 150 mm Spot Small Particles Spot SiO2 10 nm to <20nm
5088request a quote 150 mm Spot Large Particles Spot PSL, SiO2 >1.6 µm to 20 µm
5062request a quote 150 mm Full PSL Full PSL 20 nm to 1.6 µm
5061request a quote 150 mm Full SiO2, NanoSilica Full SiO2 20 nm to 1.6 µm
5064request a quote 150 mm Full Process Particles Full Process Particles 20 nm to 1.6 µm

* Range of particle size available for the indicated item. Particle size standards are only available in discrete sizes.

Additional Deposits

Individual deposits can be added to the base item to create a Wafer Deposition Calibration Standard with virtually any number of particle deposits.

Model Additional Wafer
Deposition Description
Deposit
Pattern
Particle
Material
Particle Size*
5028request a quote Spot PSL Spot PSL 20 nm to 1.6 µm
5029request a quote Spot SiO2, NanoSilica Spot SiO2 20 nm to 1.6 µm
5030request a quote Spot Si3N4 Spot Si3N4 20 nm to 1.6 µm
5036request a quote Spot Al2O3 Spot Al2O3 20 nm to 1.6 µm
5077request a quote Spot Process Particles Spot Process Particles 20 nm to 1.6 µm
5042request a quote Spot Small Particles Spot SiO2 10 nm to <20 nm
5040request a quote Spot Large Particles Spot PSL, SiO2 >1.6 µm to 20 µm
5093request a quote Full PSL Full PSL 20 nm to 1.6 µm
5094request a quote Full SiO2, NanoSilica Full SiO2 20 nm to 1.6 µm
5095request a quote Full Process Particles Full Process Particles 20 nm to 1.6 µm
5096request a quote Full Small Particles Full SiO2 10 nm to <20n m
5097request a quote Full Large Particles Full PSL, SiO2 >1.6 µm to 20 µm

Wafer Inspection

MSP can inspect a 200 mm or 300 mm bare silicon wafer deposited with particles using a Scanning Surface Inspection System (SSIS) with ~35 nm sensitivity (KLA Surfscan SP2). Inspection results are provided in the Deposition Summary that accompanies the Calibration Standard, including a scan image with particle size information and approximate count for each deposit.

Witness Wafers

To validate deposition processing of a customer's film wafer, patterned wafer, or glass wafer, we typically deposit particles on a Witness Wafer before depositing on the customer's wafer using the same deposition recipe. The Witness Wafer (200 mm or 300 mm) is inspected using the SSIS.

Each Witness Wafer comes with a Deposition Summary, which includes SSIS inspection results (Report Only). At additional cost, the Witness Wafer can be shipped to the customer (Report & Ship).

For particle size <60 nm (PSL light-scattering-equivalent), a 300 mm Witness Wafer is recommended because 300 mm wafers generally have lower background counts at small sizes and provide better signal-to-noise than 200 mm wafers. For larger particle sizes, 200 mm wafers are more cost-effective.

Model Witness Wafer Description Wafer Size Report Ship
5014request a quote 200 mm SSIS Report Only 200mm X  
5076request a quote 200mm with SSIS Report - Ship 200 mm X X
5020request a quote 300 mm SSIS Report Only 300 mm X  
5075request a quote 300 mm with SSIS Report - Ship  300 mm X X

Features & Benefits

  • Widest range of particle materials and sizes
  • Over 100 particle size standards available
  • Customizable deposit patterns and locations
  • Particle size control with nanometer-level accuracy for nanoparticles
  • Consistent particle size with sub-nanometer resolution for nanoparticles
  • Particle count from 100 to millions per recipe
  • Quick turnaround for faster learning
  • Triple-wrap packaging for low-adder transport

Applications

  • Wafer inspection tool calibration
  • Inspection tool development and qualification
  • Incoming wafer inspection/qualification
  • Production wafer monitoring